Polishing & Planarization
For the perfect substrate
Fusaike Colloidal Silica can be used to physically and chemically polish various substrates to create nearly defect-free, flat surfaces. Our aqueous dispersions of colloidal silica is commonly used with polishing pads to smooth and polish uneven surfaces. This is the preferred process in the manufacture of integrated circuits and high performance substrates.
Fusaike Colloidal Silica is also a key component in the optical lens industry. Following the rough shaping of an optical substrate using a diamond stylus, it is polished to a deformation-free surface using colloidal silica.
Benefits when using Fusaike Colloidal Silica
1. Predictable and repeatable polishing performance
2. Consistent particle size and pH with low level of impurities
3. High removal rate to desired surface finish
4. High cost efficiency
5. Often eliminates intermediate polishing steps
6. Safe to handle
7. Easy to use
How it works
The ideal balance between the surface removal rate and surface roughness, or waviness, is achieved by selecting the proper silica particle with respect to: size, morphology, size distribution, concentration, pH and impurity level.